Our Capabilities
From silicon to shipment — one team, every discipline.
What we do
Every discipline your product needs — under one roof, in tight coordination.
Electronics Design
Mixed-signal and power electronics, wireless connectivity and FPGA development. From schematic capture through PCB layout and DFM review — production-ready boards, first time.
Explore →Firmware & Embedded Software
Bare-metal, RTOS and Linux-based firmware across ARM, RISC-V and FPGA targets. Cloud connectivity, OTA update pipelines and host-side software included.
Explore →Mechanical Design
Enclosures, gantry systems and precision motion — designed around your electronics from day one. In-house CNC, 3D printing and laser cutting for fast iteration.
Explore →Manufacturing & Test
In-house PCBA and mechanical fabrication for DVT and PVT builds. Volume production through our PA and Guadalajara partners. EOL test fixtures, calibration and fulfilment included.
Explore →One team. Total accountability.
All four disciplines work in tight parallel from day one — not sequentially handed off between separate teams. That integration is where the schedule and cost savings come from.
Ready to build?
Tell us about your product idea. We’ll follow up within one business day.